| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3d535adb8c533928fc9819cf5cfe200c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-9205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68354
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80201
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-9202
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06524
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06527
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80948
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80896
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-291
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-92
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
| filingDate |
2018-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be729e1fb072fe24ac6ce02c4b1682ea
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecb13dc4f9e3dabe24556f3dc7584134 |
| publicationDate |
2020-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2020075444-A1 |
| titleOfInvention |
Wafer-level packaging method and package structure thereof |
| abstract |
A wafer-level packaging method and a package structure are provided. In the packaging method, a device wafer integrated with a first chip is provided. The device wafer includes a first front surface integrated with the first chip and a first back surface opposite to the first front surface. A first oxide layer is formed on the first front surface. A second chip is provided to include a bonding surface, on which a second oxide layer is formed. A carrier substrate is provided to be temporarily bonded with the surface of the second chip that faces away from the bonding surface. The second chip is bonded with the device wafer through bonding the first and the second oxide layers using a fusion bonding process. The second chip and the carrier substrate are debonded. An encapsulation layer is formed on the first oxide layer and covers the second chip. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021082874-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-116053202-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11063022-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10790260-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-4202981-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11315789-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-3131469-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020212004-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2023026052-A1 |
| priorityDate |
2018-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |