| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-20 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-296
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-5046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4085 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate |
2019-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_289e8748cb5c9417b1cc93c3818a4f46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36671b6e24eb9f5c8740fced7685ecd9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_815dd96aa12ccdc93519d587b3a77d31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7c1e0d50fcf446089bf6d63d3ed4588
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9656b3d798918c0961620748f78b3f6 |
| publicationDate |
2020-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2020048455-A1 |
| titleOfInvention |
Heat-curable resin composition for semiconductor encapsulation and semiconductor device |
| abstract |
Provided are a resin composition superior in moldability, and capable of yielding a cured product exhibiting a low elastic modulus even at a high temperature and no decrease in glass-transition temperature and having a favorable reflow resistance and heat resistance; and a semiconductor device encapsulated by such cured product. The resin composition is a heat-curable resin composition for semiconductor encapsulation, and contains:n (A) an epoxy resin being solid at 25° C.; (B) an organopolysiloxane having, in one molecule, at least one cyclic imide group and at least one siloxane bond; (C) an inorganic filler; and (D) an anionic curing accelerator. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113800816-A |
| priorityDate |
2018-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |