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filingDate 2019-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b144fa7efb3bc20e047ee9cb1e3453eb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4cdb13d4b93853fc7bde54f2b8e44c28
publicationDate 2020-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2020045825-A1
titleOfInvention Component Carrier With Component Embedded in Cavity and With Double Dielectric Layer on Front Side
abstract A component carrier includes a base structure with component carrier material and forming a cavity, a component embedded in the cavity, a first electrically insulating layer structure connected to a front side of the base structure and to the component and at least partially filling a gap between the component and the base structure, and a second electrically insulating layer structure connected to the first electrically insulating layer structure at a connection surface of the first electrically insulating layer structure. The connection surface opposes an opposing surface of the second electrically insulating layer structure faces away from the first electrically insulating layer structure.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11445601-B2
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priorityDate 2018-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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