http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020039126-A1

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filingDate 2017-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d023d11133af638c4e146e9429306475
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publicationDate 2020-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2020039126-A1
titleOfInvention Durably sealing connection between inlay and polymer production method therefor
abstract The invention relates to a method ( 100 ) for establishing a connection between an inlay ( 1, 1′, 1″ ) and a polymer ( 3 ) at least partially surrounding the inlay, wherein a monomer ( 2 ) is brought into contact ( 110 ) with the inlay ( 1, 1′, 1″ ) and is subsequently polymerized ( 120 ) to form the polymer ( 3 ), wherein the temperature T E of the inlay ( 1, 1′, 1″ ) is increased ( 130 ) at least briefly at least to that temperature T M that the monomer ( 2 ) assumes at its maximum during its exothermic polymerization ( 120 ) to form the polymer ( 3 ), and/or that ensures that the heat flow always runs from the inlay ( 1, 1′, 1″ ) to the monomer ( 2 ). The invention also relates to a method ( 200 ), ( 300 ), ( 400 ) for the sealing integration of an inlay ( 1, 1′, 1″ ) in a component ( 5 ). The invention also relates to a device ( 50 ) for carrying out the method ( 100 ), comprising a conveyor ( 51 ) for a lead frame ( 11 ) in which a multiplicity of inlays ( 1, 1′, 1″ ) are able to be fed, and an at least two-part ( 52 a, 52 b ) mould ( 52 ) which is closable about an individual inlay ( 1, 1′, 1″ ) and has a feed ( 53 ) for feeding the monomer ( 2 ) into the space ( 54 ) between the mould ( 52 ) and the inlay ( 1, 1′, 1″ ), wherein a current supply ( 55 ) is provided for the resistive and/or inductive heating ( 131 ) of the inlay ( 1, 1′, 1″ ) surrounded by the mould ( 52 ).
priorityDate 2016-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 28.