| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1543b2b19ec0e331a0dcd89888cbef5f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B44C3-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09036
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0121
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0528
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2037-268 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1275
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-048
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-007 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate |
2017-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d12faaab890ecfee6174d049a93d91bb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cae6ce82766997a705f214f81c82c4d1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1039ac25aae42cc819b0262bcd053acf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ec7c7797158d9ff910a769d446e3cf9 |
| publicationDate |
2020-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2020029443-A1 |
| titleOfInvention |
Preparation of Electrical Circuits by Adhesive Transfer |
| abstract |
Multilayer articles that include electrical circuits are prepared by the adhesive transfer of electrical circuit elements to the surface of an adhesive. A number of different methodologies are used, with all of the methodologies including the use of simple layers of circuit-forming material on a releasing substrate and structuring to generate circuit elements which can be transferred to an adhesive surface. In some methodologies, a structured releasing substrate is used to selectively transfer circuit-forming material, either from protrusions on the releasing substrate or from depressions on the releasing substrate. In other methodologies, an unstructured releasing substrate is used and either embossed to form a structured releasing substrate or contacted with a structured adhesive layer to selectively transfer circuit-forming material. |
| priorityDate |
2016-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |