| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_14ba71eccbb5f65a22b78f39b3c6ffc3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0792
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0292 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-0023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00325
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00333
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-008 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 |
| filingDate |
2019-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_54b88fae2e1b1871b2669d66426c5f53
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_454f94435deb14bd8eaf4237d55b4ba6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09290ed6b0605d0524cdaa37573cee05 |
| publicationDate |
2020-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2020024131-A1 |
| titleOfInvention |
Process for manufacturing microelectromechanical devices, in particular electroacoustic modules |
| abstract |
A process for manufacturing MEMS devices, includes forming a first assembly, which comprises: a dielectric region; a redistribution region; and a plurality of unit portions. Each unit portion of the first assembly includes: a die arranged in the dielectric region; and a plurality of first and second connection elements, which extend to opposite faces of the redistribution region and are connected together by paths that extend in the redistribution region, the first connection elements being coupled to the die. The process further includes: forming a second assembly which comprises a plurality of respective unit portions, each of which includes a semiconductor portion and third connection elements; mechanically coupling the first and second assemblies so as to connect the third connection elements to corresponding second connection elements; and then removing at least part of the semiconductor portion of each unit portion of the second assembly, thus forming corresponding membranes. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/IT-202100019718-A1 |
| priorityDate |
2018-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |