Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36f8253f3d0d59bcd9259217d4385d10 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-40245 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53266 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53223 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-367 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53252 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49568 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3733 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-433 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3736 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3675 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0203 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-367 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 |
filingDate |
2019-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cbc9487f813e9b840f941b8ea26cd1d4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c18b41ea4e1ff69864ad8fb2f9a347d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e495ce327d72a7bcbb4531b03451e5f5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a67ee0a29f508f4bc46c6d6a5e994d5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0342dbf3570e00f84a6dfe3685a0a2da |
publicationDate |
2020-01-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2020006187-A1 |
titleOfInvention |
Heat Dissipation Device, Semiconductor Packaging System and Method of Manufacturing Thereof |
abstract |
A heat dissipation device includes a first part having a first material and a surface portion, and a second part on the surface portion. The second part has a second material and a porosity. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11705413-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2023079413-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11302657-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11315852-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11227846-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022102297-A1 |
priorityDate |
2018-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |