| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5bfefd800f38f5e22f9b809a498f78ed |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1433
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0792
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-097
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0264 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L19-143
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L19-0627
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L19-0069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L19-0061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L19-142
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L19-0084
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L19-148
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00309
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4821
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0058
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3135
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L13-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01L19-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01L13-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 |
| filingDate |
2018-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4590672fb5140063aa519a82e0f03680
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62fa1c1cc9dd51675ae863eb9882ff3a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2047b654b6e32ab299080226a47e089 |
| publicationDate |
2019-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2019368958-A1 |
| titleOfInvention |
Overmolded lead frame assembly for pressure sensing applications |
| abstract |
A process of forming an overmolded lead frame assembly for a pressure sensing application includes clamping both sides of a lead frame to performing a primary overmolding operation to prevent resin flash on wire bonding areas on the lead frame. The process also includes performing the primary overmolding operation to form a primary mold that covers selected portions of the lead frame on first and second sides of the lead frame assembly. The primary mold forms an electronics cavity on the first side of the lead frame assembly to enable subsequent wire-bonding of a microelectromechanical system (MEMS) pressure sensing element to the wire bonding areas. The process further includes performing a secondary overmolding operation to form a secondary mold on the second side of the lead frame assembly. The secondary mold covers an exposed portion of the lead frame beneath the wire bonding areas. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7327247-B2 |
| priorityDate |
2018-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |