| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c3a2f00e72ba6e4c09b6da573427fbed |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-31749
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-31745 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N1-286
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N1-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3002 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N1-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-305 |
| filingDate |
2019-07-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0749baa213524b027e8b89432dea357b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9eaaff05b77b004111f4b8a61d0cf67c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ade9234270a0a420f81e8645b197e6b5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51f923dd650cd004b643333d7dd0139f |
| publicationDate |
2019-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2019353566-A1 |
| titleOfInvention |
Methods for acquiring planar view stem images of device structures |
| abstract |
A method of preparing a sample that includes milling an initial deep lamella within a wafer using a focused ion beam. The initial deep lamella includes at least one internal structure within an upper portion of the initial deep lamella. The method further includes lifting the initial deep lamella out of the wafer, placing the initial deep lamella on an upper surface of the wafer on a lateral side of the initial lamella, milling a planar shallow lamella out of a portion of the initial deep lamella and the wafer beneath the initial deep lamella to include at least substantially an entire length of the at least one internal structure of the initial deep lamella, lifting the planar shallow lamella out of the wafer, and placing the planar shallow lamella on a carbon grid. |
| priorityDate |
2018-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |