| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f3518dca003902d9f332ad08ac9a6ffe |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E10-549
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14641
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1464
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14612 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K39-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14687
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14689
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K30-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14667
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14636
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14638
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14665
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14612 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-146 |
| filingDate |
2017-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a7698d79b582b65d2e0eac12f0bbb29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9b6e71628f843cde078369f43e67e904
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1111abab60b5646418f09b5ec87290b5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_968bf42a98606464b71e7bba949b438e |
| publicationDate |
2019-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2019326345-A1 |
| titleOfInvention |
Solid-state imaging device and method for producing the same, and electronic device |
| abstract |
There is provided an imaging device with a semiconductor substrate having a first side and a second side opposite the first side. A photoelectric conversion unit is on the first side of the semiconductor substrate. A multilayer wiring layer is on the second side of the semiconductor substrate. A through electrode extends between the photoelectric conversion unit and the multilayer wiring layer. The multilayer wiring layer includes a local wiring layer. A second end of the through electrode is in direct contact with the local wiring layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10615228-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11101327-B2 |
| priorityDate |
2016-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |