| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8d629238b5c0aada2fc57fa5dbb59a41 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10689
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49433
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-4823
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-30107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-6611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-6638
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49173 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-303
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0236
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0243
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-66 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-66 |
| filingDate |
2018-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_042330f73afe24761e17bb8091b0386b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a95168c6298119b8aaf3bd0452a25fc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_772a3f1bc7227b57515e69de7b3d98df
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_15265a7523aafed1e821d4aa167f0c75
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bea1ed791f528eb38e2a6c7d83908141 |
| publicationDate |
2019-10-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2019313523-A1 |
| titleOfInvention |
Apparatus and methods for enhancing signaling bandwidth in an integrated circuit package |
| abstract |
Embodiments described herein provide an electronic device having an integrated circuit disposed in a surface mount package. The surface mount integrated circuit package comprises a first pin and a second pin of the integrated circuit configured to couple the integrated circuit to a first terminal and a second terminal disposed on a circuit board. The first pin and second pin define a first connector and a second connector of a differential connector pair in the surface mount integrated circuit package for transferring differential signals from the integrated circuit to the circuit board. The surface mount integrated circuit package comprises an isolation stud disposed between the first pin and the second pin. The isolation stud is disconnected from the integrated circuit and configured to enlarge a gap between the first pin and the second pin relative to respective gaps of other pins coupling the electronic device to the circuit board. |
| priorityDate |
2018-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |