| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f61dffc3e598cf3338893ecbfeab8ac8 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10196
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-185
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C7-13 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C17-0652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C7-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0213
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C17-0658
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0254
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0263
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C1-148
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C1-1406 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C7-13 |
| filingDate |
2016-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_083ddd8e151d35d9f57c51502133f017
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2fc09e943249f9174f9619bec873a6d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4f6535d2874ab6ca5aeb71d89d91cc58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eeaa607d17af06c1da3b5c98ba80f7d4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d876d001fa0a7b55da535f3ffc46b828 |
| publicationDate |
2019-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2019306970-A1 |
| titleOfInvention |
Circuit protection assembly |
| abstract |
A circuit protection assembly has a protection element having a positive temperature coefficient of resistance and consisting of a polymer-based conductive composite material layer tightly clamped and fixed between two metal electrodes and a copper clad laminate having a through hole in a middle thereof, wherein the protection element is provided in the through hole, the copper clad laminate serves as a substrate for the circuit protection assembly and has an adhesive layer on an upper surface and a lower surface thereof, so as to cover the protection element in a space formed by the copper clad laminate and the upper and the lower adhesive layers. The protection element having a positive temperature coefficient of resistance is electrically connected to a protected circuit via a conductive part. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I812508-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I810091-B |
| priorityDate |
2016-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |