| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a8a9982b1666c54b5bf02d6c944891e4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C2217-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C2218-335 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C17-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C27-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B41-87
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C21-002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C17-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B41-89
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C17-002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C23-006 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B41-89
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B41-87
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C17-00 |
| filingDate |
2017-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_875c3e74a966c7685a511134ba3ccc2c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b129cb84ed3efe4478b75d1917ffb40b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abc69c276f853ddea983c44e8b7442da
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45d9b0fe20023edd40474d57c15a3b5a |
| publicationDate |
2019-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2019270669-A1 |
| titleOfInvention |
Methods and apparatus for positioning and securing glass, glass-ceramic and ceramic substrates for coating |
| abstract |
A method of preparing a glass, glass-ceramic or ceramic substrate for coating that includes: treating a primary surface of a carrier to form a carrier bonding surface, the carrier having a thickness of at least 2 mm; disposing a carrier surface modification layer on the carrier bonding surface; bonding the carrier to at least one substrate having a substrate bonding surface and a thickness from about 0.1 mm to about 3.5 mm, the bonding conducted by temporarily joining the carrier at the carrier surface modification layer to the substrate at the substrate bonding surface. Further, the treating and disposing steps are conducted such that an adhesion energy between the carrier surface modification layer and the substrate bonding surface is from 50 to 1000 mJ/m 2 after the bonding step. |
| priorityDate |
2016-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |