| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_98f92c496e4f5c70f34681fb4bf526d2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B2562-12 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04B11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-4483
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01S7-52017
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-5207
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01S7-52079 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04B11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61B8-08 |
| filingDate |
2019-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_048db0aa319da11ac3d3c76671a9b01d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e90badafe82e076666bbb408cda5be37
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fca759faaaf0e67dc3443e9087bed922
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9016b59d3a299e608b7c390fa3eaa783
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a05e9a4a3314a9dbf92800121f70680a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ded577b80a06de2133f3ca81364afef1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c153e924fdb3ac90cd1989da11674411 |
| publicationDate |
2019-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2019261955-A1 |
| titleOfInvention |
Ultrasound apparatuses and methods for fabricating ultrasound devices |
| abstract |
Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application-specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11484911-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11558062-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11504093-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11388524-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022165021-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11655141-B2 |
| priorityDate |
2017-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |