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filingDate 2019-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2019-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2019232439-A1
titleOfInvention Self-heating solder flux material
abstract A self-heating solder flux material includes a solder flux material and a multi-compartment microcapsule. The solder flux material includes a solvent carrier, and the multi-compartment microcapsule includes a first compartment, a second compartment, and an isolating structure. The first compartment contains a first reactant, and the second compartment contains a second reactant. The isolating structure separates the first compartment from the second compartment. The isolating structure is adapted to rupture in response to a stimulus.
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