| abstract |
An ink contains an admixture of a copper nanoparticle, a copper precursor molecule (e.g. a copper-aminediol complex), and a polymeric binder, the polymeric binder containing a polyester, polyimide, polyether imide or any mixture thereof having surface 5 functional groups that render the polymeric binder compatible with and/or soluble in a diol. The ink may be deposited on a substrate providing a trace that is conductive and directly solderable and has better mechanical strength than copper inks containing other types of polymeric binders. |