| abstract |
Provided is a curable particulate silicone composition that is hot-meltable, has excellent handling workability, curing properties, and gap fill properties when melted, and gives a cured product having excellent flexibility and resilience from room temperature to high temperatures of about 150° C. Also provided are pellets or the like formed by molding the curable particulate silicone composition. The curable particulate silicone composition comprises: (A) hot-meltable silicone particles that have a softening point of 30° C. or higher and have a hydrosilylatable group and/or a radical reactive group; (B) an inorganic filler (particulates) that is substantially free of coarse particles having an average particle diameter of 10.0 μm or larger; and (C) a curing agent. When cured, the composition gives a cured product having a storage modulus of 2000 Mpa or lower at 25° C. and of 100 Mpa or lower at 150° C. |