| abstract |
[Object] To provide a substrate device, an electronic apparatus, and a method for manufacturing a substrate device that can make large the gap between a semiconductor substrate and a wiring substrate by making the height of a solder ball high. [Solution] A substrate device includes: a substrate; an electrical connection unit provided on the substrate; a metal post provided on the electrical connection unit; and a metal film that is provided in one body from a tip surface to at least part of a side surface of the metal post and of which wettability to a solder material is lower than wettability to the solder material of the metal post. |