| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c85d78c6a4459b5dbbc49c82a4c5c107 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-202 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B9-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-0815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-0869
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-441 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-24 |
| filingDate |
2016-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_63a2bb69ec28d9c1169841e1da7563ec
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_53f2a89d6c9836c978931f2ea105a079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_99aed3b49d8b2a141dc7f03a49d7a0cd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b7a1e1c96e700c3a64950573324efba6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_584aef0303e0b3565bb8cd06cd2c3dbd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_870ddcbdb445a1d40e57f84b129fa15f |
| publicationDate |
2019-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2019156973-A1 |
| titleOfInvention |
Semiconductive Shield Free of Weld Lines and Protrusions |
| abstract |
Semiconductive shield layers for power cable constructions are made from a composition comprising: (A) A nonpolar, ethylene-based polymer having a density of greater than (>) 0.90 g/cc and a melt index of >20 g/10 min at 190° C./2.16 Kg; (B) A polar polymer consisting of ethylene and an unsaturated alkyl ester having 4 to 20 carbon atoms; (C) Acetylene carbon black; and (D) A curing agent; with the provisos that (1) the composition has a phase separated structure, and (2) the weight ratio of nonpolar polymer to polar polymer is from 0.25 to 4. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112724500-A |
| priorityDate |
2016-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |