| abstract |
Curative systems for butyl based compositions are provided herein. The present curative systems provide consistent curing speeds for butyl based compositions, low moduli at low strain, higher elongation and higher percent retention in elongation at heat aging conditions. The curative systems have about 0.5 phr to about 3 phr metal oxide, about 0.3 phr to about 3 phr fatty acid, at least to about 2 phr sulfur, and at least about 2 phr of cure accelerator. |