| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5477 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5419
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-296
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5442
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-544
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5419
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 |
| filingDate |
2018-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e60b940ec6f10c400773ec8172f499d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ab1a1249519ce7d8f09b0ce6f788fc6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88cf43b812972e1ee5bce076f865ce6b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e7c1e0d50fcf446089bf6d63d3ed4588 |
| publicationDate |
2019-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2019127580-A1 |
| titleOfInvention |
Semiconductor Encapsulating Resin Composition and Semiconductor Device |
| abstract |
A resin composition comprising a thermosetting resin, an inorganic filler and an organosilicon compound of specific structure is provided. The inorganic filler is briefly treated with the organosilicon compound to have a high affinity to the resin. The composition is improved in flow and impact resistance and suited for encapsulating semiconductor devices. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11639361-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022162237-A1 |
| priorityDate |
2017-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |