| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d7576285d411d00c697e07270d2814a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-031
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-035 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-72
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-90
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 |
| filingDate |
2017-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e56df7f0bda552e61e9c3e4565284417
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36ec5473025a8fb9c65346ffa30cd7c3 |
| publicationDate |
2019-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2019127215-A1 |
| titleOfInvention |
Semiconductor apparatus and method for manufacturing the same |
| abstract |
A semiconductor apparatus includes a first substrate having a first surface, a semiconductor device, a first flexible connecting member electrically connected to the semiconductor device, a first pad connected to the first flexible connecting member, and a second substrate including a bump and an interconnect. The second substrate is a low-temperature sintered ceramic substrate containing alkali metal ions. The first pad is connected to the interconnect via the bump. The first pad has at least a portion overlapping the semiconductor device in a plan view seen in a direction along a normal to the first surface. The semiconductor apparatus can thus be miniaturized. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11174157-B2 |
| priorityDate |
2016-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |