| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06517
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06513
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06506
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16148
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06586
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1403
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-14051
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1703
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11462
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06582
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13164
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06555
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13017
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-17051
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1134
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
| filingDate |
2018-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c66cef490dd5fd237f2171971ddf6a6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7cb7a4e61a5a12c1ac521fbac20d7473
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da8e5f7279951e796b974189caeaa8a3 |
| publicationDate |
2019-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2019123028-A1 |
| titleOfInvention |
3D Die Stacking Structure with Fine Pitches |
| abstract |
A package includes package includes a first package component including a first plurality of electrical connectors at a top surface of the first package component, and a second plurality of electrical connectors longer than the first plurality of electrical connectors at the top surface of the first package component. A first device die is over the first package component and bonded to the first plurality of electrical connectors. A second package component is overlying the first package component and the first device die. The second package component includes a third plurality of electrical connectors at a bottom surface of the second package component. The third plurality of electrical connectors is bonded to the second plurality of electrical connectors. A fourth plurality of electrical connectors is at a bottom surface of the second package. The second and the fourth plurality of electrical connectors comprise non-solder metallic materials. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10999983-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020205358-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11477950-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2023057116-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10854577-B2 |
| priorityDate |
2013-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |