abstract |
Provided herein are methods and compositions for chemical mechanical polishing (CMP) of metals. The present methods and compositions involve the use of a corrosion inhibitor having the general formula C m H 2m+1 —(OCH 2 CH 2 ) n -L-R in the CMP slurry composition, where m is an integer between 6 and 11, inclusive of end points, and n is an integer greater than or equal to 6, L is a bond, —O—, —S—, —R 1 —, —S—R 1 —, or —O—R 1 —, where R 1 is a C 1-4 alkylene; and R is an anionic group. The present methods and compositions can be used to achieve a high metal removal rate, while effectively inhibiting metal corrosion during CMP, and are particularly useful for CMP of cobalt (Co). |