| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5f28b6aa59119abf900bfb8f8f3d1e43
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_356a5d26a00aa630c8f2f8e21d271f8d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-48 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-627
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-617
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2017-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c85fc1dcda8ce882d60b77f741440f16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d368114393cca5c8f368436d397bd78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f39965cf5175f1b43f798657db9aae4f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a2d7c8758be24f186b576236704563c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e27831e300c20523d9a80c2d564d4904 |
| publicationDate |
2019-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2019100848-A1 |
| titleOfInvention |
Copper Electroplating Solution and Copper Electroplating Process |
| abstract |
The present disclosure relates to a copper electroplating solution and a copper electroplating process. The solution includes following components: 20 to 240 g/L of copper sulfate pentahydrate, 20 to 300 g/L of sulfuric acid, 25 to 120 mg/L of chlorine ion, 0.1 to 20 mg/L of a brightener, 1 to 2000 mg/L of an inhibitor, and the balance is deionized water; The brightener is selected from two of the group consisting of alkyl sulfonic acid thiols and derivatives thereof; the inhibitor is selected from one or more compounds of non-ionic surfactants. The solution of this disclosure can greatly improve the current density of plating and the throwing power (TP) of electroplating of the through hole of flexible boards, wherein the TP value can reach more than 200%, and the electroplating deposited copper layer in the hole is flat and the quality thereof meets the requirements of the flexible board. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113956479-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115233263-A |
| priorityDate |
2016-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |