| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-9212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1431
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1305
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-92
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80896
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76805
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06524
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12036
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-9202 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-80 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2018-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f6e1cf99545998ede8c6a4bb9b4abac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1fbc87a5b4493645e9ccd11b76867b3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_868a9c5a2ec009c37c21cf58d5c271b1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c8bacfcd111c74355b1d13fb774dc5b7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_67c71643e2cced80e88b465cda7b4bbc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d596f9658ba663553d3976f504a5ca27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b5bf61765db54e1c93da7f7ed5820994
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e0d9795c1dd7fbcb00bf54e3fa46923
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34f807e64eda5320cf900f8d18ac60bb |
| publicationDate |
2019-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2019051559-A1 |
| titleOfInvention |
Interconnect structure for stacked device |
| abstract |
A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element. The first substrate includes a dielectric block in the first substrate; and a plurality of first conductive features formed in first inter-metal dielectric layers over the first substrate. The stacked IC device also includes a second semiconductor element bonded on the first semiconductor element. The second semiconductor element includes a second substrate and a plurality of second conductive features formed in second inter-metal dielectric layers over the second substrate. The stacked IC device also includes a conductive deep-interconnection-plug coupled between the first conductive features and the second conductive features. The conductive deep-interconnection-plug is isolated by dielectric block, the first inter-metal-dielectric layers and the second inter-metal-dielectric layers. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021127086-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11776982-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11387271-B2 |
| priorityDate |
2013-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |