| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-054
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0706
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F2203-04103
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0289
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-187
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-122
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1625
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1868
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1612
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1893
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-208
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-168
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F3-0443
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1608
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1667
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-185
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-187
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F3-041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20 |
| filingDate |
2018-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2bd4b8a0f05187f249ce5d89c58fd87d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_418adfc5c521106563c7c05c50a58134
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72a677d21787b8c3bd3f12b1b1dbce22 |
| publicationDate |
2019-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2019010608-A1 |
| titleOfInvention |
Method for producing electroconductive laminate, laminate, and electroconductive laminate |
| abstract |
An object of the present invention is to provide a method for producing an electroconductive laminate, which is capable of forming a metal layer having low resistance at a position corresponding to a patterned plated layer, a laminate, and an electroconductive laminate. The method for producing an electroconductive laminate of the present invention includes: a step of forming a plated layer forming layer on a base material using a predetermined plated layer forming composition; a step of subjecting the plated layer forming layer to a patternwise exposure treatment and a development treatment to form a patterned plated layer containing a portion having a line width of less than 3 μm; a step of applying a plating catalyst or a precursor thereof to the patterned plated layer using an alkaline plating catalyst-applying liquid containing the plating catalyst or the precursor thereof; and a step of subjecting the patterned plated layer to which the plating catalyst or the precursor thereof has been applied to a plating treatment using a plating liquid containing aminocarboxylic acids to form a metal layer on the patterned plated layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11783557-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11561631-B2 |
| priorityDate |
2016-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |