Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7542cdde926ccc0ad7b27ea92c083088 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S156-924 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2315-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1158 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1917 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F2202-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-208 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-133331 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B41-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F3-0412 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B43-006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F1-1637 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B43-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B41-00 |
filingDate |
2017-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_13c820ce230595486e3ce5542d629d76 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8905193f645281398029acef8dde485d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_428bd9557fb8b7e96333ab5e8a169690 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4be19ff712c7d12909bb6c0cadec4d4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_01975b5730d9af652c9947426f731a22 |
publicationDate |
2019-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2019001654-A1 |
titleOfInvention |
Thermally conductive de-bonding aid |
abstract |
Touchscreen computing devices are often assembled by applying an adhesive to an interface perimeter between a cover glass and a chassis. Occasionally, a device is de-bonded to troubleshoot errors in the functionality of the device. The adhesive often is resistant to releasing the bond between the cover glass and a chassis by mechanical force and the cover glass may be damaged during disassembly. Passive and/or active de-bonding aids facilitate transfer of thermal energy to the adhesive in a manner that avoids or minimizes the transfer of thermal energy to heat-sensitive components of the device. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11084955-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021035835-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11476420-B2 |
priorityDate |
2017-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |