| abstract |
Disclosed is an assembly comprising an insulation material and a copper foil disposed on the insulation material, wherein the copper foil has a thickness of less than or equal to 6 μm, and the insulation material is made from a resin composition comprising oxazolidone epoxy resin, oxydianiline type benzoxazine resin and a curing agent. The assembly achieves desirable balanced properties in peel strength, glass transition temperature, dimensional change after reflow, thermal resistance, and dielectric properties. |