| abstract |
A method of forming a semiconductor device includes forming a first dummy gate structure over a substrate, forming gate spacers over the substrate, cutting the first dummy gate structure to form separated dummy gate portions, forming a dielectric feature between the dummy gate portions, and performing a thermal process to the dielectric feature to contract the dielectric feature, wherein the contraction of the dielectric feature deforms at least one of the gate spacers such that a distance between the gate spacers is increased. |