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filingDate 2018-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e578568934aaf41e84f8b4571a4e1fd9
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publicationDate 2018-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2018309012-A1
titleOfInvention Process of manufacturing an avalanche diode
abstract In one form, a process of manufacturing an avalanche photodiode includes forming an insulating layer over an active region of a semiconductor substrate. A shallow terminal of the avalanche photodiode is defined using a first patterned mask. A first dopant is implanted through the first patterned mask and the insulating layer to form the shallow terminal. The first patterned mask is removed. A deep terminal of the avalanche photodiode is defined using second patterned mask. A second dopant is implanted through the second patterned mask and insulating layer to form the deep terminal of the avalanche photodiode. A respective terminal of at least one of the shallow terminal and the deep terminal is defined using a respective patterned mask that forms at least two regions that are spatially separated from each other with no implanted structure located in a space therebetween.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022352400-A1
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