| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f52dcae8b80ff3b166cb02f8b5e82c72 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L2200-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L2300-0663
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L2300-0645
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L2300-0627
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L2300-0887 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-333
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L3-5027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L3-502715
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01L3-502707 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B01L3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N27-333 |
| filingDate |
2017-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c6283c78192d97d72d94916db69f4ff2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_446eb154676153722f312961cafe4533 |
| publicationDate |
2018-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2018290137-A1 |
| titleOfInvention |
Microfluidics chip with sensor die clamping structures |
| abstract |
Aspects of the embodiments are directed to a microfluidic chip that includes a plurality of openings to expose a microfluidic channel. The plurality of openings are within a recessed area of the microfluidics chip, the recess defining a surface onto which a sensor die can be clamped. The surface can include a clamping bump that contacts a membrane of a solid-state chemical sensor. The surface can also include a glue stop that, in some embodiments, can act as a spacer to prevent over-compression of the sensor die as it is clamped onto the microfluidic chip. The microfluidic chip can include a rigid structure, such as a printed circuit board, that is affixed to a top surface of the microfluidic chip. The rigid structure can include contact pads that are electrically connected to sensor electrodes on the sensor die by a wire. |
| priorityDate |
2017-04-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |