| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_069a92549123806a5d654dc036a676e9 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1605
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1642
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1803 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6723 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-34 |
| filingDate |
2018-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2406cca20e71e5dfca142b9e990e05b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2e0266003b4abf4829870b2276f88921
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_851e2c94a4083c0d3e8ee96cb2497fb9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6695b862bc32b2d4734f80e0f0bbec5 |
| publicationDate |
2018-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2018282892-A1 |
| titleOfInvention |
Plating method and plating apparatus |
| abstract |
A plating method for plating a substrate having resist opening portions is provided. The plating method includes a resist residue removing step of removing resist residues in the resist opening portions of the substrate by spraying first process liquid to a surface of the substrate on which the resist opening portions are formed, a liquid filling step of soaking the substrate passed through the removing step in second process liquid to fill the resist opening portions of the substrate with the second process liquid, and a plating step of plating the substrate passed through the liquid filling step. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11232958-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019202021-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11192151-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10603757-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10908428-B2 |
| priorityDate |
2017-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |