| abstract |
Provided is a thermosetting resin composition which is capable of obtaining, as a result of being cured, a highly reliable cured product exhibiting excellent moisture resistance, heat resistance, and mechanical strength. The present invention includes a polyalkenyl phenol resin (A) and an aromatic polymaleimide compound (B). The polyalkenyl phenol resin (A) has, in a molecule thereof, at least one aromatic ring unit (a1) which has or does not have a 2-alkenyl group bonded thereto, and in which a phenolic hydroxyl group is alkyl-etherified, and at least one aromatic ring unit (a2) which has a phenolic hydroxyl group, and which has or does not have a 2-alkenyl group bonded thereto. At least one of the aromatic ring units (a1, a2) has a 2-alkenyl group. Each of the aromatic ring units is bonded by a linking group. When m represents the number of the aromatic ring units (a1), and n represents the number of the aromatic ring units (a2), the ratio of n to (m+n) is 10-60%. The polyalkenyl phenol resin (A) is included in an amount at which the amount of 2-alkenyl groups becomes 0.4-1.5 mol per mol of maleimide groups in the aromatic polymaleimide compound (B). |