http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018273804-A1

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filingDate 2015-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2018-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2018273804-A1
titleOfInvention Application of adhesives
abstract Applying heat activatable adhesive to a substrate, the adhesive is solid at ambient temperature and can be melted at a temperature below its heat activation temperature wherein the adhesive formulation is supplied to a hot melt applicator where it is heated to above its melting point and below its activation temperature and the melt viscosity of the molten adhesive is controlled so that it can be ejected from the hot melt applicator onto a substrate to provide a coherent bead that adheres to the substrate and is dry to the touch on cooling and upon activation the adhesive is capable of expanding with a volume expansion greater than about 250%.
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