http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018233473-A1

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c19a91365ed494d9fe27d24190d4459f
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81951
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-10126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13113
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13139
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2201-40
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-264
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3613
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G65-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-025
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-36
filingDate 2016-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8f6cf246f23c9cb2562a4ab92df6ed9e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a05e92c4cb3246f75ff50f1fd3b1db9
publicationDate 2018-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2018233473-A1
titleOfInvention Paste thermosetting resin composition, semiconductor component, semiconductor mounted article, method for manufacturing semiconductor component, and method for manufacturing semiconductor mounted article
abstract Provided is a paste thermosetting resin composition containing solder powder, a thermosetting resin binder, an activator, and a thixotropy imparting agent. The solder powder has a melting point ranging from 100° C. to 240° C., inclusive. The thermosetting resin binder contains a main agent and a curing agent. The main agent contains a di- or higher functional oxetane compound.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10834819-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020273823-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020128668-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020192234-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113172291-A
priorityDate 2015-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID159445911
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID159173719
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID450682263
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID450304544

Total number of triples: 52.