| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_59c820ad08f8533c7440ae1d9235b168 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0603
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48257
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-06181 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-495
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49548
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-778
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-62 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 |
| filingDate |
2018-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de81289d26785a8e560320a06e394f2c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_097c3a0c955c26cab2026a317a5c0ba2 |
| publicationDate |
2018-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2018224496-A1 |
| titleOfInvention |
Device Including a Compound Semiconductor Chip |
| abstract |
A device includes a leadframe having a diepad and leads, a compound semiconductor chip arranged over a first surface of the diepad and including gate, source electrode and drain electrodes, and an encapsulation material covering the compound semiconductor chip and diepad. A second surface of the diepad opposite the first surface is exposed from the encapsulation material. The device also includes a first lead of the leadframe electrically coupled to the gate electrode, a second lead of the leadframe electrically coupled to the source electrode, a third lead of the leadframe electrically coupled to the source electrode, and a fourth lead of the leadframe electrically coupled to the drain electrode. The third lead is configured to provide a sensing signal representing an electrical potential of the source electrode to a gate driver circuit. The gate driver circuit is configured to drive the gate electrode based on the sensing signal. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102019104518-A1 |
| priorityDate |
2015-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |