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publicationDate 2018-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2018207933-A1
titleOfInvention Tin-silver diffusion soldering for thin joints without flux
abstract A method of bonding two components includes plating a first of the components with a first silver layer, a tin layer, and a second silver layer, plating a second of the components with silver, inserting the first and second components into a pre-heated press, and applying pressure to the components causing the components to bond. A method of manufacturing a print head includes plating a piezoelectric layer with a first silver layer, a tin layer, and a second silver layer, plating a steel layer of a jet stack with silver, inserting the piezoelectric layer and the steel layer into a pre-heated press, and applying pressure to the piezoelectric layer and the steel layer causing the layers to bond.
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