| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_05f67031e6c3c3c2f65444e118997342 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-202 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1064
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1071
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D179-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D179-08 |
| filingDate |
2017-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d429f533de89450d0689ae41b6bc3d5e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d495e83eef8568779b55e36f80c359d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_47b595a81cdb3d1bd407a9409e75540d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6807a96f6c0e9cb30b7a072e3f870bc1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0dd6e59c5ca16504e3292b50441714e6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_77d0afdc85f9a7ef52587a9d8d58f097
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72e22dff75e85271c4e31c2f1259af00 |
| publicationDate |
2018-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2018201805-A1 |
| titleOfInvention |
Resin composition, polyimide film and method for manufacturing polyimide film |
| abstract |
A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of n n n n n n n n n n the Ar′ represents a group selected from a group consisting of phenyl having a chemical structural formula of n n n n n n n n n n diphenyl ether having a chemical structural formula of n n n n n n n n n n biphenyl having a chemical structural formula n n n n n n n n n n hexafluoro-2,2-diphenylpropane having a chemical structural formula of n n n n n n n n n n benzophenone having a chemical structural formula of n n n n n n n n n n and diphenyl sulfone having a chemical structural formula of n n n n n n n n n n and any combination thereof, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A polyimide film and a method for manufacturing the polyimide film using the resin composition are also provided. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10894887-B2 |
| priorityDate |
2017-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |