http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018201501-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B06B1-0292 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R31-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R19-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B06B1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 |
| filingDate | 2018-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8c73dc64e5abecaeb33d3d9612daebdd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e176054885778511e565c7c291d282b5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_adae09020eb471fbf0749c1e31ca4582 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa62803341ede83a6eb4723fe244c211 |
| publicationDate | 2018-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-2018201501-A1 |
| titleOfInvention | Capacitive micromachined ultrasonic transducer and method of fabricating the same |
| abstract | A capacitive micromachined ultrasonic transducer and a method of fabricating the same are provided. The capacitive micromachined ultrasonic transducer includes a device substrate including a first trench defining a plurality of first portions corresponding to an element and a second trench spaced apart from the first trench; a supporting unit provided on the device substrate, the supporting unit defining a plurality of cavities; a membrane provided on the supporting unit to cover the plurality of cavities; a top electrode electrically connected to a second portion in the second trench through a via hole penetrating through the membrane and the supporting unit; and a through silicon via (TSV) substrate provided on a bottom surface of the device substrate, the TSV substrate including a first via metal connected to the plurality of first portions corresponding to the element and a second via metal connected to the second portion. |
| priorityDate | 2013-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123 |
Total number of triples: 22.