abstract |
Provided is a thermally conductive resin composition having a specific gravity of 1.4-2.0 and an In-Plane thermal conductivity of 1 W/(m·K) or higher, and containing at least (A) 30-90% by mass of a thermoplastic resin, (B) 9-69% by mass of an inorganic filler having a thermal conductivity of 1 W/(m·K) or higher, and (C) 0.05-10% by mass of a crystallization accelerator. |