http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018127545-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_54e280d53549dd4cab11b7f16b4e9d77 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-30 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-26 |
| filingDate | 2018-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa257f1787958a27601de57440c81882 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b5fc8b802312a30d303e0994c6482ae http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51bdd8bc24bf265c70ac3cc25bbe27cb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87262e5ac07a5512c217285a3b77d96b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_29ef18bb7316178748d7347c7881d966 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_992ce0dfec673bdef428772f11c99a6d |
| publicationDate | 2018-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-2018127545-A1 |
| titleOfInvention | Copolymerized Polyamide Resin, Method for Preparing the Same and Molded Article Comprising the Same |
| abstract | A copolymerized polyamide resin includes a polymer of a monomer mixture comprising a dicarboxylic acid component comprising adipic acid and a dicarboxylic acid represented by Formula 1, wherein each R 1 is independently a C 1 to C 5 alkyl group and a is an integer from 0 to 4, and a diamine component comprising m-xylene diamine and a diamine represented by Formula 2, wherein A is a single bond or a C 1 to C 10 hydrocarbon group, R 2 and R 3 are each independently a C 1 to C 5 alkyl group, and b and c are each independently an integer from 0 to 4, wherein the copolymerized polyamide resin has a difference between a melting temperature (Tm) and a crystallization temperature (Tc) of about 50° C. or more. The copolymerized polyamide resin may have excellent heat resistance and reduced or no gel generation and yellowing phenomenon in a molding process. |
| priorityDate | 2014-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 103.