Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-324 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-161 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66818 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66795 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-845 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-1037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823821 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823431 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7851 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-785 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-0653 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-0649 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-161 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-16 |
filingDate |
2017-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ae1bef5f136bcc22ef9b8ccd681ab804 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f01682eeaecc5bac09a769243d6aba2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b216a1fbec3e4bdacbad393880bc2188 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_201f76e45dcff7217058823f62cb8e1c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9109b68b55594387713c374f294c46cb |
publicationDate |
2018-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2018090599-A1 |
titleOfInvention |
Forming a sacrificial liner for dual channel devices |
abstract |
Semiconductor devices and methods of forming the same include forming a liner over one or more channel fins on a substrate. An etch is performed down into the substrate using the one or more channel fins and the liner as a mask to form a substrate fin underneath each of the one or more channel fins. An area around the one or more channel fins and substrate fins is filled with a flowable dielectric. The flowable dielectric is annealed to solidify the flowable dielectric. The anneal oxidizes at least a portion of sidewalls of each substrate fin, such that each substrate fin is narrower in the oxidized portion than in a portion covered by the liner. |
priorityDate |
2016-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |