| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7542cdde926ccc0ad7b27ea92c083088 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04N5-372
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04N5-376
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04N25-74
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04N5-378
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04N25-75
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06T3-4007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14618
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14601
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04N25-71 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06T3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04N5-372
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04N5-378
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04N5-376 |
| filingDate |
2016-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba3165efde8b9787997026a0c21d50e1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ca4885d2126c48a4a279602a678e6f0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f27710e5c3bc4e50206860d013b1be21
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25e723c99e10f2882d11fb01527fe0f6 |
| publicationDate |
2018-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2018076257-A1 |
| titleOfInvention |
Strain Relieving Die for Curved Image Sensors |
| abstract |
Techniques for fabricating a semiconductor die having a curved surface can include placing a substantially flat semiconductor die in a recess surface of a concave mold such that corners or edges of the semiconductor die are unconstrained or are the only portions of the semiconductor die in physical contact with the concave mold. The semiconductor die can include through-die cut lines that can lead to substantially less tension in the semiconductor die as compared to the case where the semiconductor die does not include through-die cut lines. Accordingly, such through-die cut lines can allow for achieving relatively large curvatures. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10600658-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10475668-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019140008-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11600655-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11335642-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022266025-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10991738-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10304900-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109003884-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10373995-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10304880-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11791277-B2 |
| priorityDate |
2016-09-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |