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filingDate 2016-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2018-02-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2018051371-A1
titleOfInvention Methods of forming rotary sputtering target
abstract A sputtering target assembly formed by relative positioning of a sputtering target body or bodies and a backing support, such that the backing support is placed within the inside diameter of the sputtering target body. The combination is heated with an induction heater surrounding the target body so that there is achieved a suitable temperature for bonding. Heating is discontinued such that there is a cooling of the bonding material and a bonding relationship established between the sputtering target body (or bodies) and the backing support. Embodiments include adding a conductive layer, as in a conductive fabric wrap, between the induction heater and internal target body(ies) that is/are inductively heated in a manner that enhances axial and radial gradient heating during bonding. The conductive wrap can be used with a low conductivity material as in an LiMO 2 (e.g., Li—CoO 2 ) target body. A non-adhesive protective wrap can also be placed about the target body such as between the conductive wrap and target body.
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