| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_26c475bcbe0c24b485b6f37c45cd921f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G65-2615
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-502
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-1575
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-42 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J175-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J175-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07C309-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G65-26 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07C309-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J175-04 |
| filingDate |
2017-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4f56ca2f4f15b1e0c7558425f20e18f8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5691246e3490e174cdf5ec773a9b49ef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_485c07754cf3d5572cdb1e1e84df10ed
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e60669887afa4eaddd60aca7a91d6586 |
| publicationDate |
2017-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2017355892-A1 |
| titleOfInvention |
Debondable Reactive Hot Melt Adhesives |
| abstract |
The present invention relates to a reactive hot melt adhesive composition, which at least partially loses its adhesiveness upon application of an electric voltage and thus allows debonding of substrates that have been bonded using said adhesive. Furthermore, the present invention relates to a method for its production and a method for forming a bonded substrate using such a reactive hot melt adhesive composition. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3835381-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11081898-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021115772-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021115774-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11655402-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3835386-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11214714-B2 |
| priorityDate |
2015-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |