| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e000ed5aabdb2248a1e5a269ab0e310e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-501
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-12 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F283-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F299-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J151-085 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F299-08 |
| filingDate |
2015-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f95d48f5c0a9fa0b6e27edde7ae420b7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b13ccd62fce9070c096fa6892621226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88ffca182b884c8f62d967bce68faaf6 |
| publicationDate |
2017-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2017355804-A1 |
| titleOfInvention |
Curable organopolysiloxane composition, semiconductor sealant comprising same, and semiconductor device |
| abstract |
Disclosed is a curable organopolysiloxane composition, comprising: (A) a curing reactive organopolysiloxane component formed by curing or semi-curing and reacting at least two or more types of organopolysiloxanes in the presence of one or more types of catalysts; and (B) a peroxide. The composition is a non-fluid at 25° C., and the melt viscosity at 100° C. is 8000 Pa·s or lower. A sealing agent comprising the curable organopolysiloxane composition and a cured product of the curable organopolysiloxane composition are also disclosed, along with a method of molding a cured product and a semiconductor device comprising the cured product. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020277492-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11530305-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11136437-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10483442-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11370917-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11479668-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3683246-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021171716-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3771731-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022032277-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11555119-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11591470-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11674000-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112300576-A |
| priorityDate |
2014-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |