http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017347464-A1

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filingDate 2015-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_388c3584a587b36222df4d526be07c0c
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publicationDate 2017-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2017347464-A1
titleOfInvention Substrate for printed wiring board and method for producing the same, printed wiring board and method for producing the same, and resin base material
abstract An object is to provide a substrate for a printed wiring board that has good circuit formability while maintaining adhesion strength between a conductive layer ( 2 ) and a base film ( 1 ). The substrate includes a base film having an insulating property ( 1 ) and a conductive layer ( 2 ) formed on at least one surface of the base film ( 1 ). The maximum height Sz, which is defined in ISO25178, of the surface of the base film ( 1 ) is 0.05 μm or more and less than 0.9 μm.
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priorityDate 2014-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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