| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02216
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02282
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3171
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D183-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
| filingDate |
2017-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_329e3054458f4ade1f74e6321b433690
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad8c1a4d20636140bf1c5899f9e5268c |
| publicationDate |
2017-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2017330803-A1 |
| titleOfInvention |
Wafer processing laminate, method for manufacturing thereof, and method for checking coverage of organic film on wafer |
| abstract |
The present invention provides a wafer processing laminate including a wafer having a surface on which unevenness and/or a protective organic film layer (A) is formed, and an organic film layer (B) with a film thickness of less than 100 nm formed on the wafer, the organic film layer (B) including a fluorescent agent that emits visible light by irradiation with ultraviolet light. This provides a wafer processing laminate in which the coverage of the thin film can be checked by a nondestructive and convenient method to make it possible to reuse the wafer, even when the thin film with a film thickness of less than 100 nm is formed onto a wafer having an uneven surface on which a circuit is formed and/or an organic film as an underlayment. |
| priorityDate |
2016-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |