| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0502
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80896
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80895
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80986
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80357
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0556
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08145 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-10 |
| filingDate |
2017-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ac71c1e98ae9c2807dbd2f4a33fbbc0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce9af55ec27663f0980aa8263081d914
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ed46112a5876baac05031eadfd8b2b1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b5bf61765db54e1c93da7f7ed5820994
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3e0d9795c1dd7fbcb00bf54e3fa46923
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a62c55f4ff227c45d1f18bdbebe8b40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2df8f77d171a0507865f738a45ca56df
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82f19c1905b3a293e46ad5b375b8ae99
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c8bacfcd111c74355b1d13fb774dc5b7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1da9c213461cfeecadd92fb8f538d83f |
| publicationDate |
2017-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2017309603-A1 |
| titleOfInvention |
3DIC Structure and Method for Hybrid Bonding Semiconductor Wafers |
| abstract |
Methods for improving hybrid bond yield for semiconductor wafers forming 3DIC devices includes first and second wafers having dummy and main metal deposited and patterned during BEOL processing. Metal of the dummy metal pattern occupies from about 40% to about 90% of the surface area of any given dummy metal pattern region. High dummy metal surface coverage, in conjunction with utilization of slotted conductive pads, allows for improved planarization of wafer surfaces presented for hybrid bonding. Planarized wafers exhibit minimum topographic differentials corresponding to step height differences of less than about 400 Å. Planarized first and second wafers are aligned and subsequently hybrid bonded with application of heat and pressure; dielectric-to-dielectric, RDL-to-RDL. Lithography controls to realize WEE from about 0.5 mm to about 1.5 mm may be employed to promote topographic uniformity at wafer edges. Improved planarity of wafers presented for hybrid bonding results in improved bond uniformity for 3DIC devices formed thereby. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023154420-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I803013-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11094528-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11101260-B2 |
| priorityDate |
2016-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |